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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
40-3551-16

40-3551-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

3564
- +

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40-3551-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3552-16

40-3552-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

2744
- +

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40-3552-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3553-16

40-3553-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

3027
- +

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40-3553-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6551-16

40-6551-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

2905
- +

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40-6551-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6552-16

40-6552-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

3442
- +

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40-6552-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6553-16

40-6553-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

2496
- +

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40-6553-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
40-3554-16

40-3554-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

2155
- +

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40-3554-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
64-9508-21

64-9508-21

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

3285
- +

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64-9508-21

Datasheet

Bulk 508 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
64-9508-31

64-9508-31

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

3963
- +

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64-9508-31

Datasheet

Bulk 508 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
550-10-600M35-001152

550-10-600M35-001152

BGA SOLDER TAIL

Preci-Dip

3957
- +

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550-10-600M35-001152

Datasheet

Bulk 550 Active BGA 600 (35 x 35) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-576M30-001101

558-10-576M30-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

3898
- +

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558-10-576M30-001101

Datasheet

Bulk 558 Active PGA 576 (30 x 30) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
510-13-323-21-005001

510-13-323-21-005001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3619
- +

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510-13-323-21-005001

Datasheet

Bulk 510 Active PGA 323 (21 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-323-21-005002

510-13-323-21-005002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2399
- +

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510-13-323-21-005002

Datasheet

Bulk 510 Active PGA 323 (21 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-323-21-005003

510-13-323-21-005003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3139
- +

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510-13-323-21-005003

Datasheet

Bulk 510 Active PGA 323 (21 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-324-18-000001

510-13-324-18-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2499
- +

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510-13-324-18-000001

Datasheet

Bulk 510 Active PGA 324 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-324-18-000002

510-13-324-18-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3079
- +

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510-13-324-18-000002

Datasheet

Bulk 510 Active PGA 324 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-324-18-000003

510-13-324-18-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3895
- +

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510-13-324-18-000003

Datasheet

Bulk 510 Active PGA 324 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
15-PRS15068-12

15-PRS15068-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2241
- +

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15-PRS15068-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
18-PLS15071-12

18-PLS15071-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3521
- +

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18-PLS15071-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
18-PRS15071-12

18-PRS15071-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2879
- +

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18-PRS15071-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
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