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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
114-83-312-41-117101

114-83-312-41-117101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

 3472
- +

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 114-83-312-41-117101

Datasheet

 Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-312-41-134161

114-83-312-41-134161

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

 2426
- +

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 114-83-312-41-134161

Datasheet

 Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-306-41-001101

116-83-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

 3715
- +

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 116-83-306-41-001101

Datasheet

 Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
714-43-102-31-018000

714-43-102-31-018000

CONN SOCKET SIP 2POS GOLD

Mill-Max Manufacturing Corp.

 674
- +

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 714-43-102-31-018000

Datasheet

 Bulk 714 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-87-304-41-013101

116-87-304-41-013101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

 3298
- +

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 116-87-304-41-013101

Datasheet

 Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-610-41-001101

614-83-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

 3345
- +

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 614-83-610-41-001101

Datasheet

 Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-318-41-003101

115-87-318-41-003101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

 2832
- +

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 115-87-318-41-003101

Datasheet

 Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
05-0518-10H

05-0518-10H

CONN SOCKET SIP 5POS GOLD

Aries Electronics

 2123
- +

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 05-0518-10H

Datasheet

 Bulk 518 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-1518-10

06-1518-10

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

 2120
- +

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 06-1518-10

Datasheet

 Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-306-41-004101

116-87-306-41-004101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

 2230
- +

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 116-87-306-41-004101

Datasheet

 Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-310-41-105101

110-83-310-41-105101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

 2789
- +

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 110-83-310-41-105101

Datasheet

 Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-312-31-012101

614-87-312-31-012101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

 3254
- +

Add To Cart

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 614-87-312-31-012101

Datasheet

 Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-310-41-007101

116-87-310-41-007101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

 3905
- +

Add To Cart

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 116-87-310-41-007101

Datasheet

 Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-310-41-105191

110-87-310-41-105191

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

 3762
- +

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 Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-314-41-134191

114-87-314-41-134191

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

 3094
- +

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 Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-308-41-001101

116-87-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

 2187
- +

Add To Cart

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 116-87-308-41-001101

Datasheet

 Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-310-41-001101

612-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

 3650
- +

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 612-83-310-41-001101

Datasheet

 Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-610-41-001101

612-83-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

 3691
- +

Add To Cart

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 612-83-610-41-001101

Datasheet

 Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-318-41-117101

114-87-318-41-117101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

 3505
- +

Add To Cart

Inquiry Now

 114-87-318-41-117101

Datasheet

 Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-88-032-17-400-TR

540-88-032-17-400-TR

CONN SOCKET PLCC 32POS TIN

Preci-Dip

 2453
- +

Add To Cart

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 540-88-032-17-400-TR

Datasheet

 Tape & Reel (TR) 540 Active PLCC 32 (4 x 8) 0.050 (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
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