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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
ESQT-106-02-F-D-472

ESQT-106-02-F-D-472

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.

 2335
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.472 (12.00mm) 0.378 (9.60mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-F-D-500

ESQT-106-02-F-D-500

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.

 3478
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.500 (12.70mm) 0.350 (8.89mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-F-D-510

ESQT-106-02-F-D-510

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.

 2383
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.510 (12.95mm) 0.340 (8.64mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-F-D-550

ESQT-106-02-F-D-550

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.

 3481
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.550 (13.97mm) 0.300 (7.62mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-F-D-555

ESQT-106-02-F-D-555

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.

 2255
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.555 (14.10mm) 0.295 (7.49mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-F-D-558

ESQT-106-02-F-D-558

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.

 2832
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.558 (14.17mm) 0.292 (7.42mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-F-D-590

ESQT-106-02-F-D-590

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.

 3397
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.590 (14.99mm) 0.260 (6.60mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-F-D-600

ESQT-106-02-F-D-600

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.

 2489
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.600 (15.24mm) 0.250 (6.35mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-F-D-625

ESQT-106-02-F-D-625

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.

 2252
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.625 (15.88mm) 0.225 (5.72mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-F-D-650

ESQT-106-02-F-D-650

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.

 3794
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.650 (16.50mm) 0.200 (5.08mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-F-D-664

ESQT-106-02-F-D-664

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.

 2216
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.664 (16.87mm) 0.186 (4.72mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-F-D-677

ESQT-106-02-F-D-677

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.

 3697
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.677 (17.20mm) 0.173 (4.40mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-F-D-680

ESQT-106-02-F-D-680

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.

 3836
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.680 (17.27mm) 0.170 (4.32mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-F-D-693

ESQT-106-02-F-D-693

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.

 2090
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.693 (17.60mm) 0.157 (4.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-F-D-700

ESQT-106-02-F-D-700

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.

 2940
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.700 (17.78mm) 0.150 (3.81mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-F-D-730

ESQT-106-02-F-D-730

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.

 2432
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.730 (18.54mm) 0.120 (3.05mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-F-D-740

ESQT-106-02-F-D-740

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.

 3338
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.740 (18.80mm) 0.110 (2.79mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-F-D-750

ESQT-106-02-F-D-750

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.

 3393
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.750 (19.05mm) 0.100 (2.54mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-F-D-751

ESQT-106-02-F-D-751

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.

 2953
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.751 (19.08mm) 0.099 (2.51mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-F-D-760

ESQT-106-02-F-D-760

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.

 2585
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.760 (19.30mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
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