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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
ESQT-108-02-F-D-535

ESQT-108-02-F-D-535

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 3127
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.535 (13.60mm) 0.315 (8.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-F-D-545

ESQT-108-02-F-D-545

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 3140
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.545 (13.84mm) 0.305 (7.75mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-F-D-550

ESQT-108-02-F-D-550

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 2322
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.550 (13.97mm) 0.300 (7.62mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-F-D-555

ESQT-108-02-F-D-555

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 2189
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.555 (14.10mm) 0.295 (7.49mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-F-D-560

ESQT-108-02-F-D-560

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 3977
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.560 (14.22mm) 0.290 (7.37mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-F-D-590

ESQT-108-02-F-D-590

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 3319
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.590 (14.99mm) 0.260 (6.60mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-F-D-600

ESQT-108-02-F-D-600

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 2664
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.600 (15.24mm) 0.250 (6.35mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-F-D-615

ESQT-108-02-F-D-615

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 3364
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.615 (15.62mm) 0.235 (5.97mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-F-D-630

ESQT-108-02-F-D-630

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 2826
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.630 (16.00mm) 0.220 (5.58mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-F-D-633

ESQT-108-02-F-D-633

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 2039
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.633 (16.08mm) 0.217 (5.51mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-F-D-650

ESQT-108-02-F-D-650

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 3716
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.650 (16.50mm) 0.200 (5.08mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-F-D-671

ESQT-108-02-F-D-671

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 2462
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.671 (17.04mm) 0.179 (4.55mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-F-D-690

ESQT-108-02-F-D-690

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 3164
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.690 (17.52mm) 0.160 (4.06mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-F-D-695

ESQT-108-02-F-D-695

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 2432
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.695 (17.65mm) 0.155 (3.94mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-F-D-700

ESQT-108-02-F-D-700

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 2667
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.700 (17.78mm) 0.150 (3.81mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-F-D-710

ESQT-108-02-F-D-710

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 2040
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.710 (18.03mm) 0.140 (3.56mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-F-D-715

ESQT-108-02-F-D-715

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 2199
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.715 (18.16mm) 0.135 (3.43mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-F-D-716

ESQT-108-02-F-D-716

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 2876
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.716 (18.19mm) 0.134 (3.40mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-F-D-725

ESQT-108-02-F-D-725

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 3781
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.725 (18.42mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-F-D-750

ESQT-108-02-F-D-750

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 2279
- +

Añadir

Investigación

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.750 (19.05mm) 0.100 (2.54mm) -55°C ~ 125°C UL94 V-0 Tin - -
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