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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
18-6511-10

18-6511-10

SOCKET 18 PIN SOLDER TAIL TIN

Aries Electronics

 3609
- +

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Investigación

 - 511 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
117-83-652-41-105101

117-83-652-41-105101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

 3506
- +

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Investigación

 117-83-652-41-105101

Datasheet

 Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-640-41-002101

116-83-640-41-002101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

 2705
- +

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Investigación

 116-83-640-41-002101

Datasheet

 Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-448-41-105101

117-87-448-41-105101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

 3006
- +

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Investigación

 117-87-448-41-105101

Datasheet

 Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 48 (2 x 24) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-652-41-002101

116-87-652-41-002101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

 2915
- +

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Investigación

 116-87-652-41-002101

Datasheet

 Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
XR2T-2021-N

XR2T-2021-N

CONN IC DIP SOCKET 20POS GOLD

Omron Electronics Inc-EMC Div

 3559
- +

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Investigación

 XR2T-2021-N

Datasheet

 Bulk,Box XR2 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
116-83-642-41-007101

116-83-642-41-007101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

 3047
- +

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Investigación

 116-83-642-41-007101

Datasheet

 Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
20-3513-11

20-3513-11

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

 2561
- +

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Investigación

 20-3513-11

Datasheet

 Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-6513-10H

12-6513-10H

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

 3663
- +

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Investigación

 12-6513-10H

Datasheet

 Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0503-20

08-0503-20

CONN SOCKET SIP 8POS GOLD

Aries Electronics

 2633
- +

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Investigación

 08-0503-20

Datasheet

 Bulk 0503 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
08-0503-30

08-0503-30

CONN SOCKET SIP 8POS GOLD

Aries Electronics

 2173
- +

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Investigación

 08-0503-30

Datasheet

 Bulk 0503 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
06-3508-20

06-3508-20

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

 2969
- +

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Investigación

 06-3508-20

Datasheet

 Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-3508-30

06-3508-30

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

 2327
- +

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Investigación

 06-3508-30

Datasheet

 Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-0518-11H

16-0518-11H

CONN SOCKET SIP 16POS GOLD

Aries Electronics

 2726
- +

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Investigación

 16-0518-11H

Datasheet

 Bulk 518 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-1518-11H

16-1518-11H

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

 2649
- +

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Investigación

 16-1518-11H

Datasheet

 Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-100-13-062101

510-83-100-13-062101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

 3068
- +

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Investigación

 510-83-100-13-062101

Datasheet

 Bulk 510 Active PGA 100 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-100-13-063101

510-83-100-13-063101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

 3391
- +

Añadir

Investigación

 510-83-100-13-063101

Datasheet

 Bulk 510 Active PGA 100 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-100-13-064101

510-83-100-13-064101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

 3752
- +

Añadir

Investigación

 510-83-100-13-064101

Datasheet

 Bulk 510 Active PGA 100 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-93-640-41-005000

117-93-640-41-005000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

 2586
- +

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Investigación

 117-93-640-41-005000

Datasheet

 Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-43-640-41-005000

117-43-640-41-005000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

 3677
- +

Añadir

Investigación

 117-43-640-41-005000

Datasheet

 Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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