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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-43-304-41-007000

116-43-304-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2653
- +

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Investigación

 116-43-304-41-007000

Datasheet

 Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-320-G-J

APA-320-G-J

ADAPTER PLUG

Samtec Inc.

 2643
- +

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Investigación

 Tube APA Active - 20 (2 x 10) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
32-0518-00

32-0518-00

CONN SOCKET SIP 32POS GOLD

Aries Electronics

 3258
- +

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Investigación

 32-0518-00

Datasheet

 Bulk 518 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
48-6511-10

48-6511-10

CONN IC DIP SOCKET 48POS TIN

Aries Electronics

 2359
- +

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Investigación

 48-6511-10

Datasheet

 Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
09-0503-21

09-0503-21

CONN SOCKET SIP 9POS GOLD

Aries Electronics

 2022
- +

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Investigación

 09-0503-21

Datasheet

 Bulk 0503 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
09-0503-31

09-0503-31

CONN SOCKET SIP 9POS GOLD

Aries Electronics

 3032
- +

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Investigación

 09-0503-31

Datasheet

 Bulk 0503 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
40-6518-101

40-6518-101

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

 3093
- +

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Investigación

 40-6518-101

Datasheet

 Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
104-13-304-41-780000

104-13-304-41-780000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

 2371
- +

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Investigación

 104-13-304-41-780000

Datasheet

 Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
10-2501-21

10-2501-21

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

 2577
- +

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Investigación

 10-2501-21

Datasheet

 Bulk 501 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-2501-31

10-2501-31

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

 3772
- +

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Investigación

 10-2501-31

Datasheet

 Bulk 501 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-9513-10T

40-9513-10T

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

 3126
- +

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Investigación

 40-9513-10T

Datasheet

 Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-0511-10

18-0511-10

CONN SOCKET SIP 18POS TIN

Aries Electronics

 2316
- +

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Investigación

 18-0511-10

Datasheet

 Bulk 511 Active SIP 18 (1 x 18) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-6518-11

40-6518-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

 2202
- +

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Investigación

 40-6518-11

Datasheet

 Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6513-11

32-6513-11

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

 2060
- +

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Investigación

 32-6513-11

Datasheet

 Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3518-01

14-3518-01

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

 3696
- +

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Investigación

 14-3518-01

Datasheet

 Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
17-0508-20

17-0508-20

CONN SOCKET SIP 17POS GOLD

Aries Electronics

 2301
- +

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Investigación

 17-0508-20

Datasheet

 Bulk 508 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
17-0508-30

17-0508-30

CONN SOCKET SIP 17POS GOLD

Aries Electronics

 2414
- +

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Investigación

 17-0508-30

Datasheet

 Bulk 508 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
510-83-160-13-001101

510-83-160-13-001101

CONN SOCKET PGA 160POS GOLD

Preci-Dip

 3170
- +

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Investigación

 510-83-160-13-001101

Datasheet

 Bulk 510 Active PGA 160 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
605-93-304-11-480000

605-93-304-11-480000

SOCKET CARRIER LOWPRO .300 4POS

Mill-Max Manufacturing Corp.

 2607
- +

Añadir

Investigación

 605-93-304-11-480000

Datasheet

 Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-43-304-11-480000

605-43-304-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

 3526
- +

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Investigación

 605-43-304-11-480000

Datasheet

 Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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