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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
10-0508-21

10-0508-21

CONN SOCKET SIP 10POS GOLD

Aries Electronics

 2056
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 10-0508-21

Datasheet

 Bulk 508 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
10-0508-31

10-0508-31

CONN SOCKET SIP 10POS GOLD

Aries Electronics

 3981
- +

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 10-0508-31

Datasheet

 Bulk 508 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
10-1508-21

10-1508-21

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

 3737
- +

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 10-1508-21

Datasheet

 Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
10-1508-31

10-1508-31

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

 2740
- +

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Investigación

 10-1508-31

Datasheet

 Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
714-43-133-31-018000

714-43-133-31-018000

CONN SOCKET SIP 33POS GOLD

Mill-Max Manufacturing Corp.

 2491
- +

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Investigación

 714-43-133-31-018000

Datasheet

 Bulk 714 Active SIP 33 (1 x 33) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-87-257-19-081101

510-87-257-19-081101

CONN SOCKET PGA 257POS GOLD

Preci-Dip

 2234
- +

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Investigación

 510-87-257-19-081101

Datasheet

 Bulk 510 Active PGA 257 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-257-20-111101

510-87-257-20-111101

CONN SOCKET PGA 257POS GOLD

Preci-Dip

 3698
- +

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Investigación

 510-87-257-20-111101

Datasheet

 Bulk 510 Active PGA 257 (20 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
714-43-230-31-018000

714-43-230-31-018000

CONN IC DIP SOCKET 30POS GOLD

Mill-Max Manufacturing Corp.

 3788
- +

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Investigación

 714-43-230-31-018000

Datasheet

 Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
50-9513-10

50-9513-10

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

 3847
- +

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Investigación

 50-9513-10

Datasheet

 Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
21-0517-90C

21-0517-90C

CONN SOCKET SIP 21POS GOLD

Aries Electronics

 3871
- +

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Investigación

 21-0517-90C

Datasheet

 Bulk 0517 Active SIP 21 (1 x 21) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-324-G-J

APA-324-G-J

ADAPTER PLUG

Samtec Inc.

 3815
- +

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Investigación

 Tube APA Active - 24 (2 x 12) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
346-93-149-41-013000

346-93-149-41-013000

CONN SOCKET SIP 49POS GOLD

Mill-Max Manufacturing Corp.

 3460
- +

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Investigación

 346-93-149-41-013000

Datasheet

 Bulk 346 Active SIP 49 (1 x 49) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-149-41-013000

346-43-149-41-013000

CONN SOCKET SIP 49POS GOLD

Mill-Max Manufacturing Corp.

 3854
- +

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Investigación

 346-43-149-41-013000

Datasheet

 Bulk 346 Active SIP 49 (1 x 49) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-83-184-15-001101

510-83-184-15-001101

CONN SOCKET PGA 184POS GOLD

Preci-Dip

 2889
- +

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Investigación

 510-83-184-15-001101

Datasheet

 Bulk 510 Active PGA 184 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-184-17-081101

510-83-184-17-081101

CONN SOCKET PGA 184POS GOLD

Preci-Dip

 2886
- +

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Investigación

 510-83-184-17-081101

Datasheet

 Bulk 510 Active PGA 184 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
22-6501-20

22-6501-20

CONN IC DIP SOCKET 22POS TIN

Aries Electronics

 3761
- +

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Investigación

 22-6501-20

Datasheet

 Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-6501-30

22-6501-30

CONN IC DIP SOCKET 22POS TIN

Aries Electronics

 2149
- +

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Investigación

 22-6501-30

Datasheet

 Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
09-0501-20

09-0501-20

CONN SOCKET SIP 9POS TIN

Aries Electronics

 3462
- +

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Investigación

 09-0501-20

Datasheet

 Bulk 501 Active SIP 9 (1 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
09-0501-30

09-0501-30

CONN SOCKET SIP 9POS TIN

Aries Electronics

 2862
- +

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Investigación

 09-0501-30

Datasheet

 Bulk 501 Active SIP 9 (1 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
123-13-304-41-001000

123-13-304-41-001000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

 3925
- +

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Investigación

 123-13-304-41-001000

Datasheet

 Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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