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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
14-820-90

14-820-90

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

 3965
- +

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Investigación

 14-820-90

Datasheet

 Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
116-83-648-41-004101

116-83-648-41-004101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

 3676
- +

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Investigación

 116-83-648-41-004101

Datasheet

 Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
22-3513-11H

22-3513-11H

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

 2483
- +

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Investigación

 22-3513-11H

Datasheet

 Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
17-0503-20

17-0503-20

CONN SOCKET SIP 17POS GOLD

Aries Electronics

 3387
- +

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Investigación

 17-0503-20

Datasheet

 Bulk 0503 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
17-0503-30

17-0503-30

CONN SOCKET SIP 17POS GOLD

Aries Electronics

 3488
- +

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Investigación

 17-0503-30

Datasheet

 Bulk 0503 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
510-83-196-14-000101

510-83-196-14-000101

CONN SOCKET PGA 196POS GOLD

Preci-Dip

 3278
- +

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Investigación

 510-83-196-14-000101

Datasheet

 Bulk 510 Active PGA 196 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
38-0511-10

38-0511-10

CONN SOCKET SIP 38POS TIN

Aries Electronics

 3928
- +

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Investigación

 38-0511-10

Datasheet

 Bulk 511 Active SIP 38 (1 x 38) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-10E

24-3518-10E

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

 3805
- +

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Investigación

 24-3518-10E

Datasheet

 Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
21-0508-20

21-0508-20

CONN SOCKET SIP 21POS GOLD

Aries Electronics

 3239
- +

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Investigación

 21-0508-20

Datasheet

 Bulk 508 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
21-0508-30

21-0508-30

CONN SOCKET SIP 21POS GOLD

Aries Electronics

 2780
- +

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Investigación

 21-0508-30

Datasheet

 Bulk 508 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
510-87-279-19-081101

510-87-279-19-081101

CONN SOCKET PGA 279POS GOLD

Preci-Dip

 2184
- +

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Investigación

 510-87-279-19-081101

Datasheet

 Bulk 510 Active PGA 279 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
11-0501-20

11-0501-20

CONN SOCKET SIP 11POS TIN

Aries Electronics

 2582
- +

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Investigación

 11-0501-20

Datasheet

 Bulk 501 Active SIP 11 (1 x 11) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
11-0501-30

11-0501-30

CONN SOCKET SIP 11POS TIN

Aries Electronics

 2355
- +

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Investigación

 11-0501-30

Datasheet

 Bulk 501 Active SIP 11 (1 x 11) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-C280-11H

16-C280-11H

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

 2031
- +

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Investigación

 16-C280-11H

Datasheet

 Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
546-83-085-11-002135

546-83-085-11-002135

CONN SOCKET PGA 85POS GOLD

Preci-Dip

 3088
- +

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Investigación

 546-83-085-11-002135

Datasheet

 Bulk 546 Active PGA 85 (11 x 11) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-085-11-002136

546-83-085-11-002136

CONN SOCKET PGA 85POS GOLD

Preci-Dip

 3349
- +

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Investigación

 546-83-085-11-002136

Datasheet

 Bulk 546 Active PGA 85 (11 x 11) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
346-93-153-41-013000

346-93-153-41-013000

CONN SOCKET SIP 53POS GOLD

Mill-Max Manufacturing Corp.

 3481
- +

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Investigación

 346-93-153-41-013000

Datasheet

 Bulk 346 Active SIP 53 (1 x 53) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-153-41-013000

346-43-153-41-013000

CONN SOCKET SIP 53POS GOLD

Mill-Max Manufacturing Corp.

 3359
- +

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Investigación

 346-43-153-41-013000

Datasheet

 Bulk 346 Active SIP 53 (1 x 53) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
16-6511-11

16-6511-11

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

 2350
- +

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Investigación

 16-6511-11

Datasheet

 Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
714-43-136-31-018000

714-43-136-31-018000

CONN SOCKET SIP 36POS GOLD

Mill-Max Manufacturing Corp.

 3675
- +

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Investigación

 714-43-136-31-018000

Datasheet

 Bulk 714 Active SIP 36 (1 x 36) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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