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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
115-93-320-41-001000

115-93-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

 121
- +

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Investigación

 115-93-320-41-001000

Datasheet

 Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
ICA-308-SGT

ICA-308-SGT

CONN IC DIP SOCKET 8POS GOLD

Samtec Inc.

 2488
- +

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Investigación

 ICA-308-SGT

Datasheet

 Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyester, Glass Filled
111-93-320-41-001000

111-93-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

 2783
- +

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Investigación

 111-93-320-41-001000

Datasheet

 Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-632-41-001000

110-41-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

 2597
- +

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Investigación

 110-41-632-41-001000

Datasheet

 Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
16-3513-10

16-3513-10

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

 3991
- +

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Investigación

 16-3513-10

Datasheet

 Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-47-648-41-001000

110-47-648-41-001000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

 166
- +

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Investigación

 110-47-648-41-001000

Datasheet

 Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 48 (1 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-328-41-105000

110-47-328-41-105000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

 103
- +

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Investigación

 110-47-328-41-105000

Datasheet

 Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-624-41-003000

115-43-624-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

 177
- +

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Investigación

 115-43-624-41-003000

Datasheet

 Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
917-93-210-41-005000

917-93-210-41-005000

CONN SOCKET TRANSIST TO100 10POS

Mill-Max Manufacturing Corp.

 3998
- +

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Investigación

 917-93-210-41-005000

Datasheet

 Tube 917 Active Transistor, TO-100 10 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
XR2A-1801-N

XR2A-1801-N

CONN IC DIP SOCKET 18POS GOLD

Omron Electronics Inc-EMC Div

 2833
- +

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Investigación

 XR2A-1801-N

Datasheet

 Bulk XR2 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
ICA-314-SST

ICA-314-SST

CONN IC DIP SOCKET 14POS GOLD

Samtec Inc.

 989
- +

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Investigación

 ICA-314-SST

Datasheet

 Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled
D2924-42

D2924-42

CONN IC DIP SOCKET 24POS GOLD

Harwin Inc.

 2150
- +

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Investigación

 D2924-42

Datasheet

 Tube D2 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic
123-93-314-41-001000

123-93-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

 2973
- +

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Investigación

 123-93-314-41-001000

Datasheet

 Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
940-44-084-17-400000

940-44-084-17-400000

CONN SOCKET PLCC 84POS TIN

Mill-Max Manufacturing Corp.

 452
- +

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Investigación

 940-44-084-17-400000

Datasheet

 Tube 940 Active PLCC 84 (4 x 21) 0.050 (1.27mm) Tin 150.0µin (3.81µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
ICA-628-STT

ICA-628-STT

CONN IC DIP SOCKET 28POS TIN

Samtec Inc.

 3577
- +

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Investigación

 ICA-628-STT

Datasheet

 Tube ICA Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
ICA-314-SGT

ICA-314-SGT

CONN IC DIP SOCKET 14POS GOLD

Samtec Inc.

 3880
- +

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Investigación

 ICA-314-SGT

Datasheet

 Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled
D0816-42

D0816-42

CONN IC DIP SOCKET 16POS GOLD

Harwin Inc.

 2725
- +

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Investigación

 D0816-42

Datasheet

 Bulk D0 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
ICF-308-S-O

ICF-308-S-O

CONN IC DIP SOCKET 8POS TIN

Samtec Inc.

 3649
- +

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Investigación

 ICF-308-S-O

Datasheet

 Tube iCF Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
383

383

40-PIN ZIF SOCKET

Adafruit Industries LLC

 3158
- +

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Investigación

 383

Datasheet

 - - Active DIP, ZIF (ZIP) 40 (2 x 20) - Gold - - Through Hole Closed Frame Solder - Gold - - -
123-43-316-41-001000

123-43-316-41-001000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

 2315
- +

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Investigación

 123-43-316-41-001000

Datasheet

 Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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