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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
117-93-764-41-005000

117-93-764-41-005000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

 2016
- +

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Investigación

 117-93-764-41-005000

Datasheet

 Tube 117 Active DIP, 0.75 (19.05mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-C212-10

40-C212-10

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

 2426
- +

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Investigación

 40-C212-10

Datasheet

 Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-43-640-41-801000

110-43-640-41-801000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

 2205
- +

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Investigación

 110-43-640-41-801000

Datasheet

 Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-93-632-41-001000

123-93-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

 2069
- +

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Investigación

 123-93-632-41-001000

Datasheet

 Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-516-11

28-516-11

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

 2101
- +

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Investigación

 28-516-11

Datasheet

 Bulk 516 Active DIP, ZIF (ZIP) 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
8080-1G24

8080-1G24

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors

 3749
- +

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Investigación

 8080-1G24

Datasheet

 Bulk - Active Transistor, TO-3 3 (Round) - Tin-Lead 20.0µin (0.51µm) Beryllium Copper Chassis Mount Closed Frame Solder - Tin-Lead 20.0µin (0.51µm) Beryllium Copper Diallyl Phthalate (DAP)
110-93-640-41-801000

110-93-640-41-801000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

 3978
- +

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Investigación

 110-93-640-41-801000

Datasheet

 Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-526-11

28-526-11

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

 2587
- +

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Investigación

 28-526-11

Datasheet

 Bulk Lo-PRO®file, 526 Active DIP, ZIF (ZIP) 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
12-6810-90C

12-6810-90C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

 2240
- +

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Investigación

 12-6810-90C

Datasheet

 Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-516-11

40-516-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

 3255
- +

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Investigación

 40-516-11

Datasheet

 Bulk 516 Active DIP, ZIF (ZIP) 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
242-1293-00-0602J

242-1293-00-0602J

CONN IC DIP SOCKET ZIF 42POS GLD

3M

 2128
- +

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Investigación

 242-1293-00-0602J

Datasheet

 Bulk Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
228-7474-55-1902

228-7474-55-1902

CONN SOCKET SOIC 28POS GOLD

3M

 3393
- +

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Investigación

 228-7474-55-1902

Datasheet

 Bulk Textool™ Active SOIC 28 (2 x 14) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled
236-6225-00-0602

236-6225-00-0602

CONN SOCKET SIP ZIF 36POS GOLD

3M

 2583
- +

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Investigación

 236-6225-00-0602

Datasheet

 Bulk Textool™ Active SIP, ZIF (ZIP) 36 (1 x 36) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
251-5949-02-0602

251-5949-02-0602

CONN ZIG-ZAG ZIF 51POS GOLD

3M

 2734
- +

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Investigación

 251-5949-02-0602

Datasheet

 Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 51 (1 x 25, 1 x 26) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
251-5949-01-0602

251-5949-01-0602

CONN ZIG-ZAG ZIF 51POS GOLD

3M

 3923
- +

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Investigación

 251-5949-01-0602

Datasheet

 Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 51 (1 x 25, 1 x 26) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
108-PRS12005-12

108-PRS12005-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

 3971
- +

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Investigación

 108-PRS12005-12

Datasheet

 Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
44-547-11E

44-547-11E

CONN SOCKET SOIC ZIF 44POS GOLD

Aries Electronics

 2015
- +

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Investigación

 44-547-11E

Datasheet

 Bulk 547 Active SOIC, ZIF (ZIP) 44 (2 x 22) - Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 20.0µin (0.51µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
AR 48-HZL-TT

AR 48-HZL-TT

CONN IC DIP SOCKET 48POS TIN

Assmann WSW Components

 3412
- +

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Investigación

 AR 48-HZL-TT

Datasheet

 Tube - Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
XR2A0815

XR2A0815

CONN IC DIP SOCKET 8POS GOLD

Omron Electronics Inc-EMC Div

 3289
- +

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Investigación

 XR2A0815

Datasheet

 Bulk XR2 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled
110-47-628-41-605000

110-47-628-41-605000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

 2336
- +

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Investigación

 110-47-628-41-605000

Datasheet

 Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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