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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-83-210-01-742101

110-83-210-01-742101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

 3667
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Investigación

 110-83-210-01-742101

Datasheet

 Bulk 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5), 6 Loaded 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-312-41-001101

110-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

 2859
- +

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Investigación

 110-83-312-41-001101

Datasheet

 Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-306-41-035101

146-83-306-41-035101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

 3294
- +

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Investigación

 146-83-306-41-035101

Datasheet

 Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-306-41-036101

146-83-306-41-036101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

 3894
- +

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Investigación

 146-83-306-41-036101

Datasheet

 Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-210-41-001101

614-87-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

 3587
- +

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Investigación

 614-87-210-41-001101

Datasheet

 Bulk 614 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-312-41-105101

110-87-312-41-105101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

 2252
- +

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Investigación

 110-87-312-41-105101

Datasheet

 Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-316-01-931101

110-87-316-01-931101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

 2498
- +

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Investigación

 110-87-316-01-931101

Datasheet

 Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-316-10-003101

110-87-316-10-003101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

 3736
- +

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Investigación

 110-87-316-10-003101

Datasheet

 Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-312-41-001101

614-87-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

 3184
- +

Añadir

Investigación

 614-87-312-41-001101

Datasheet

 Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-316-41-005101

117-87-316-41-005101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

 2712
- +

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Investigación

 117-87-316-41-005101

Datasheet

 Bulk 117 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-308-41-105161

110-83-308-41-105161

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

 2010
- +

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Investigación

 110-83-308-41-105161

Datasheet

 Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-306-41-002101

116-83-306-41-002101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

 3913
- +

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Investigación

 116-83-306-41-002101

Datasheet

 Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-310-41-003101

115-83-310-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

 3535
- +

Añadir

Investigación

 115-83-310-41-003101

Datasheet

 Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-310-41-003101

116-87-310-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

 3935
- +

Añadir

Investigación

 116-87-310-41-003101

Datasheet

 Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
02-0513-11

02-0513-11

CONN SOCKET SIP 2POS GOLD

Aries Electronics

 3072
- +

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Investigación

 02-0513-11

Datasheet

 Bulk 0513 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0518-10H

04-0518-10H

CONN SOCKET SIP 4POS GOLD

Aries Electronics

 3556
- +

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Investigación

 04-0518-10H

Datasheet

 Bulk 518 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-1518-10H

04-1518-10H

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

 2561
- +

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Investigación

 04-1518-10H

Datasheet

 Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0518-10

05-0518-10

CONN SOCKET SIP 5POS GOLD

Aries Electronics

 2140
- +

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Investigación

 05-0518-10

Datasheet

 Bulk 518 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
114-83-308-41-134191

114-83-308-41-134191

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

 3014
- +

Añadir

Investigación

 Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
1814655-7

1814655-7

CONN SOCKET SIP 10POS GOLD

TE Connectivity AMP Connectors

 2651
- +

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Investigación

 1814655-7

Datasheet

 Bulk - Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Thermoplastic, Polyester
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