English Hello ! Welcome to Shenzhen Taoxiong (TX) Electronics Co., Ltd. !
BOM

SHOPPING CART

Item (S)
Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
32-6552-18

32-6552-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

3980
- +

Add To Cart

Inquiry Now

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
32-6553-18

32-6553-18

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2369
- +

Add To Cart

Inquiry Now

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-3554-18

32-3554-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

3903
- +

Add To Cart

Inquiry Now

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
40-6554-18

40-6554-18

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

2409
- +

Add To Cart

Inquiry Now

40-6554-18

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
40-3551-18

40-3551-18

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

2338
- +

Add To Cart

Inquiry Now

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
40-3552-18

40-3552-18

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

2460
- +

Add To Cart

Inquiry Now

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
40-3553-18

40-3553-18

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

3287
- +

Add To Cart

Inquiry Now

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
42-6554-18

42-6554-18

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

3053
- +

Add To Cart

Inquiry Now

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
36-3574-18

36-3574-18

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

3406
- +

Add To Cart

Inquiry Now

36-3574-18

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3575-18

36-3575-18

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

3870
- +

Add To Cart

Inquiry Now

36-3575-18

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6574-18

36-6574-18

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

3133
- +

Add To Cart

Inquiry Now

36-6574-18

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6575-18

36-6575-18

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2056
- +

Add To Cart

Inquiry Now

36-6575-18

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3552-18

44-3552-18

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

2882
- +

Add To Cart

Inquiry Now

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
44-3553-18

44-3553-18

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

2239
- +

Add To Cart

Inquiry Now

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
44-6551-18

44-6551-18

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

2552
- +

Add To Cart

Inquiry Now

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
44-6552-18

44-6552-18

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

2042
- +

Add To Cart

Inquiry Now

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
441-PGG21001-40

441-PGG21001-40

CONN SOCKET PGA GOLD

Aries Electronics

2553
- +

Add To Cart

Inquiry Now

441-PGG21001-40

Datasheet

Bulk PGG Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
169-PLS13001-12

169-PLS13001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2637
- +

Add To Cart

Inquiry Now

169-PLS13001-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
235-3019-02-0602

235-3019-02-0602

CONN ZIG-ZAG ZIF 35POS GOLD

3M

3530
- +

Add To Cart

Inquiry Now

235-3019-02-0602

Datasheet

Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 35 (1 x 17, 1 x 18) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
96-PRS14024-12

96-PRS14024-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3736
- +

Add To Cart

Inquiry Now

96-PRS14024-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
Total 21991 Records«Prev1... 721722723724725726727728...1100Next»
Request a Quote
Part Number
Quantity
Contact
Email
Company
Comments