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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
44-6551-16

44-6551-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

3848
- +

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44-6551-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6554-16

44-6554-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

2252
- +

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44-6554-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
85-PRS11008-12

85-PRS11008-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3718
- +

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85-PRS11008-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
518-77-600M35-001106

518-77-600M35-001106

CONN SOCKET PGA 600POS GOLD

Preci-Dip

3831
- +

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518-77-600M35-001106

Datasheet

Bulk 518 Active PGA 600 (35 x 35) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
101-PRS13022-12

101-PRS13022-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2001
- +

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101-PRS13022-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
101-PRS13023-12

101-PRS13023-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2513
- +

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101-PRS13023-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PLS16017-12

30-PLS16017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2563
- +

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30-PLS16017-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PLS16018-12

30-PLS16018-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3275
- +

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30-PLS16018-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PLS16020-12

30-PLS16020-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2684
- +

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30-PLS16020-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PLS16022-12

30-PLS16022-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3597
- +

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30-PLS16022-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PRS16017-12

30-PRS16017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3934
- +

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30-PRS16017-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PRS16018-12

30-PRS16018-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2877
- +

Add To Cart

Inquiry Now

30-PRS16018-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PRS16020-12

30-PRS16020-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2583
- +

Add To Cart

Inquiry Now

30-PRS16020-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PRS16022-12

30-PRS16022-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2286
- +

Add To Cart

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30-PRS16022-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
108-PLS12005-12

108-PLS12005-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3680
- +

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108-PLS12005-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
108-PLS12024-12

108-PLS12024-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3541
- +

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108-PLS12024-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
108-PRS12024-12

108-PRS12024-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2664
- +

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108-PRS12024-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
108-PRS13129-12

108-PRS13129-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2697
- +

Add To Cart

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108-PRS13129-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
48-3551-16

48-3551-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

3495
- +

Add To Cart

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48-3551-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-3552-16

48-3552-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

3383
- +

Add To Cart

Inquiry Now

48-3552-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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