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Mfr. Part #	Stock	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
210-41-308-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3392	- + Añadir Investigación	Datasheet	Tube	210	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-91-308-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3601	- + Añadir Investigación	Datasheet	Tube	210	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-310-41-001000 CONN IC DIP SOCKET 10POS GOLD Mill-Max Manufacturing Corp.	3826	- + Añadir Investigación	Datasheet	Tube	126	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-310-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2327	- + Añadir Investigación	Datasheet	Tube	126	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
8080-1G17 CONN TRANSIST TO-3 3POS TIN TE Connectivity AMP Connectors	2158	- + Añadir Investigación	Datasheet	Bulk	8060	Active	Transistor, TO-3	3 (Oval)	-	Tin	-	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Tin	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)
116-93-210-41-008000 CONN IC DIP SOCKET 10POS GOLD Mill-Max Manufacturing Corp.	3808	- + Añadir Investigación	Datasheet	Tube	116	Active	DIP, 0.2 (5.08mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-210-41-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2566	- + Añadir Investigación	Datasheet	Tube	116	Active	DIP, 0.2 (5.08mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-084-13-081101 PGA SOLDER TAIL Preci-Dip	3408	- + Añadir Investigación	Datasheet	Bulk	550	Active	PGA	84 (13 x 13)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-41-306-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3343	- + Añadir Investigación	Datasheet	Tube	115	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-306-41-001000 SKT IC OPEN LOWPRO Mill-Max Manufacturing Corp.	2489	- + Añadir Investigación	Datasheet	Tube	115	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-47-210-41-001000 STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp.	2416	- + Añadir Investigación	Datasheet	Tube	111	Active	DIP, 0.2 (5.08mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-310-41-003000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	2612	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-310-41-003000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	3815	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-310-41-001000 CONN IC DIP SOCKET 10POS GOLD Mill-Max Manufacturing Corp.	3236	- + Añadir Investigación	Datasheet	Tube	115	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-310-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2737	- + Añadir Investigación	Datasheet	Tube	115	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-41-310-41-117000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3978	- + Añadir Investigación	Datasheet	Tube	114	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-91-310-41-117000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3676	- + Añadir Investigación	Datasheet	Tube	114	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-210-41-001000 STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp.	2448	- + Añadir Investigación	Datasheet	Tube	116	Active	DIP, 0.2 (5.08mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-41-210-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3213	- + Añadir Investigación	Datasheet	Tube	115	Active	DIP, 0.2 (5.08mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-210-41-001000 SKT IC OPEN LOWPRO Mill-Max Manufacturing Corp.	2720	- + Añadir Investigación	Datasheet	Tube	115	Active	DIP, 0.2 (5.08mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

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