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Mfr. Part #	Stock	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
126-41-310-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3959	- + Añadir Investigación	Datasheet	Tube	126	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-310-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3637	- + Añadir Investigación	Datasheet	Tube	126	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-3554-10 CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics	2308	- + Añadir Investigación	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
317-91-103-41-005000 CONN SKT SNG Mill-Max Manufacturing Corp.	2630	- + Añadir Investigación	Datasheet	Bulk	317	Active	SIP	3 (1 x 3)	0.070 (1.78mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.070 (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-41-306-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2223	- + Añadir Investigación	Datasheet	Tube	111	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-91-306-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3227	- + Añadir Investigación	Datasheet	Tube	111	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-47-306-41-117000 STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp.	3464	- + Añadir Investigación	Datasheet	Tube	114	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
48-6518-10M CONN IC DIP SOCKET 48POS GOLD Aries Electronics	3641	- + Añadir Investigación	Datasheet	Bulk	518	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
104-11-210-41-780000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3813	- + Añadir Investigación	Datasheet	Tube	104	Active	DIP, 0.2 (5.08mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-306-41-001000 CONN IC DIP SOCKET 6POS GOLD Mill-Max Manufacturing Corp.	2141	- + Añadir Investigación	Datasheet	Tube	115	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-306-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3265	- + Añadir Investigación	Datasheet	Tube	115	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-93-310-41-001000 CONN IC DIP SOCKET 10POS GOLD Mill-Max Manufacturing Corp.	3904	- + Añadir Investigación	Datasheet	Tube	111	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-310-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3724	- + Añadir Investigación	Datasheet	Tube	111	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-47-314-41-003000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	2908	- + Añadir Investigación	Datasheet	Tube	115	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-306-41-780000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3369	- + Añadir Investigación	Datasheet	Tube	104	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-210-31-012000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	2122	- + Añadir Investigación	Datasheet	Tube	614	Active	DIP, 0.2 (5.08mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-210-31-012000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	2504	- + Añadir Investigación	Datasheet	Tube	614	Active	DIP, 0.2 (5.08mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-43-306-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2151	- + Añadir Investigación	Datasheet	Tube	210	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-93-306-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3244	- + Añadir Investigación	Datasheet	Tube	210	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-41-210-41-117000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3768	- + Añadir Investigación	Datasheet	Tube	114	Active	DIP, 0.2 (5.08mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

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